Taiwan

Experience the vibrant tech startup landscape in Taiwan with Tech in Asia. Explore exclusive insights and in-depth coverage of the country's thriving industry. Stay ahead of the curve by subscribing to our premium subscription or signing up for our free newsletter. Join our community and gain valuable knowledge about the latest tech trends and opportunities in Taiwan's dynamic startup ecosystem.
Foxconn 2nd-quarter net profit rises 35% on AI demand
  • News

Foxconn 2nd-quarter net profit rises 35% on AI demand

The profit increase came off a high base, as Foxconn had previously said the year-earlier quarter was a record for a second quarter.
Aiko Gao Ishida · · 1 min read
Microsoft eyes 300,000 Maia AI chips for 2027
  • News

Microsoft eyes 300,000 Maia AI chips for 2027

About 70% of Azure AI workloads still ran on Nvidia hardware in late 2025.
Aiko Gao Ishida · · 1 min read
TSMC July revenue jumps 45% as AI demand stays strong
  • News

TSMC July revenue jumps 45% as AI demand stays strong

TSMC held 69.9% of the global foundry market in 2025.
Diya Lal · · 1 min read
Taiwan chipmaker Nanya plans $10.7b fab investment
  • News

Taiwan chipmaker Nanya plans $10.7b fab investment

The fab is being built in New Taipei City’s Nanlin Technology Park under a phased project that began in 2022.
Diya Lal · · 1 min read
  • News

Foxconn July revenue hits record on AI demand

Foxconn, a supplier to Nvidia and Apple, said growth was led by its cloud and networking business, which includes AI servers and other data center hardware.
Grace Priscilla Teo · · 1 min read
  • News

Taiwan’s Wistron posts strong H1, approves new spending

The Tainan facility will support Wistron’s internal AI computing needs and provide computing resources for AI research and education through donated computing power.
Grace Priscilla Teo · · 1 min read
  • News

MediaTek plans $5b financing for AI chips

MediaTek plans to produce its first custom AI chip in Q4, with a second in 2028.
Diya Lal · · 1 min read
  • News

TSMC explores new AI chip packaging with Kinsus

TSMC mainly uses CoWoS, or Chip-on-Wafer-on-Substrate, to package high-end AI processors, including chips for customers such as Nvidia and AMD.
Naomi Li Gan · · 1 min read
  • News

Taiwanese chipmaker UMC expands Singapore facility

UMC said the expansion is aimed at meeting customer demand from growing AI adoption.
Aiko Gao Ishida · · 1 min read
  • News

Taiwan’s Wistron opens $700m Texas plant for Nvidia

Wistron said it would also make the next-generation Vera Rubin Superchip, which follows Grace Blackwell in Nvidia’s roadmap.
Grace Priscilla Teo · · 1 min read