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Taiwanese chipmaker UMC expands Singapore facility
United Microelectronics Corp (UMC), a Taiwan-based semiconductor foundry, said on July 29 it will fit out cleanroom space and buy tools for Singapore’s Phase 4 facility to expand silicon photonics capacity.
It will also begin construction of a new fab building at its Tainan campus in Taiwan for future manufacturing and more advanced packaging capacity.
UMC has described Singapore as a high-volume 12-inch wafer manufacturing base that will bring annual output to more than 1 million wafers.
The company did not disclose current or planned silicon photonics capacity for Phase 4.
UMC said the expansion is aimed at meeting customer demand from growing AI adoption.
In Taiwan, the new Tainan building is intended to house future Phase 7 and Phase 8 facilities.
UMC did not provide a new capital spending figure. The Singapore and Tainan projects will be carried out in phases and aligned with long-term customer commitments.
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