Intel

Intel, Broadcom warn financing could constrain AI growth
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Intel, Broadcom warn financing could constrain AI growth

AI data centers are often funded through bank debt, bond issuances, and private credit.
Aiko Gao Ishida · · 1 min read
SK hynix in talks with Intel on Ohio chip plan: sources
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SK hynix in talks with Intel on Ohio chip plan: sources

If a deal goes ahead, it would be SK hynix’s first time making memory chips in the US.
Diya Lal · · 1 min read
Intel-backed chipmaker Altera confidentially files for US IPO
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Intel-backed chipmaker Altera confidentially files for US IPO

Its programmable chips power data centers, telecom networks, industrial gear, and AI systems.
Minh Le · · 1 min read
Intel seeks about $20b in share sale: report
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Intel seeks about $20b in share sale: report

The offering may price at about US$95 a share or above, a 6.5% discount to Intel’s August 7 closing price.
Naomi Li Gan · · 1 min read
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TSMC explores new AI chip packaging with Kinsus

TSMC mainly uses CoWoS, or Chip-on-Wafer-on-Substrate, to package high-end AI processors, including chips for customers such as Nvidia and AMD.
Naomi Li Gan · · 1 min read
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Intel sees up to $16.8b Q3 revenue as AI demand grows

Intel Foundry’s revenue also rose from US$5.421 billion in the first quarter of 2026, though the unit lost US$2.437 billion at the operating level in that quarter.
Diya Lal · · 1 min read
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Intel, AMD seek long-term China CPU deals, sources say

AI data center demand has tightened supply and pushed up prices.
Aiko Gao Ishida · · 1 min read
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Intel, Fortinet partner on next-gen security chip

Fortinet’s SP5 chip offers 17x faster firewall performance and 88% lower power use than standard CPUs.
Minh Le · · 1 min read
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Bitcoin steady as oil spike clouds Fed rate-cut bets

That macro risk can pressure both crypto and equities. South Korea’s Kospi also fell 3.5% in a broader technology selloff.
Naomi Li Gan · · 1 min read
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Intel deploys ASML High-NA for Panther Lake chips

ASML says the EXE:5000 can print more than 185 wafers an hour and is aimed at high-volume manufacturing in 2025 and 2026.
Naomi Li Gan · · 1 min read