Nintendo’s next gen revealed…well kind of

Nintendo News has revealed that it has both the name and the possible specs of Nintendo’s next gen console. Allow us to introduce the highly anticipated and mostly speculated Fusion DS, the next gen handheld and the Fusion Terminal, Nintendo’s next gen console.

Before we get too far into the specs, keep in mind that Nintendo does like to use code names. The Wii was referred to as “Revolution” and the Gamecube was “Dolphin” before either of the consoles were actually revealed. So it is likely that the Fusion name won’t stick.

It is also worth noting that Nintendo News repeatedly mentioned that these specs may not actually be official and that it could be completely fictional. The only thing they knew for sure was the name, but hey, it’s always fun to speculate.

Could the DS look more like this?

According to Nintendo News we can expect that the Fusion DS will have:

• CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
• COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
• 2 130 mm DVGA (960 x 640) Capacitive Touchscreen
• Slide Out Design with Custom Swivel Tilt Hinge
• Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
• Low End Vibration for Gameplay and App Alerts
• 2 Motorized Circle Pads for Haptic Feedback
• Thumbprint Security Scanner with Pulse Sensing Feedback
• 2 1mp Stereoptic Cameras
• Multi-Array Microphone
• A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
• 3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
• NFC Reader
• 3G Chip with GPS Location
• Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
• 16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigabytes)
• Nintendo 3DS Cart Slot
• SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
• Mini USB I/O
• 3300 mAh Li-Ion battery

Well what does that mean? Aside from the massive overhaul in output, the DS is getting rid of its clamshell design for a more stylish slide out and swivel look. The handheld will feature two motorized circle pads, something the 3DS lacked, and will even include a thumb print scanner for that extra security you always wanted.

It’s not a bad upgrade, but nowhere near as impressive as the speculated Fusion Terminal looks to be.

The source over at Nintendo News states that the Fusion Terminal will have:

• GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
• CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
• Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
  MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAMED KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
• 802.11 b/g/n Wireless
• Bluetooth v4.0 BLE
• 2 USB 3.0
• 1 Coaxial Cable Input
• 1 CableCARD Slot
• 4 Custom Stream-Interface Nodes up to 4 Wii U GamePads
• Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic
• Versatile Disc (HVD) and Nintendo 3DS Card Slot
• 1 HDMI 2.0 1080p/4K Port
• Dolby TrueHD 5.1 or 7.1 Surround Sound
• Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
• Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with
• 300 Gigs of Internal Flash Storage

That’s a lot to take in, so here are the highlights. Nintendo is keeping its GamePad and Wiimote, but this time around you can use four GamePads at once. That is, if you have the money to afford them. The console will have a FUSION Holographic Versatile Disk that will be able to hold terabytes worth of memory and is speculated to be its storage medium. Oddly enough, there are two potential versions of the Fusion Terminal that offer even more Internal Flash Storage. We don’t know what’s up with all of this storage potential, but it is intriguing.