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SoftBank plans record $4.1b bond issuance
SoftBank Group plans to issue bonds totaling 600 billion yen (US$4.10 billion) aimed at retail investors, according to a filing made on Apr. 7.
The bonds will mature in May 2030 and offer yields ranging from 3% to 3.6%, with the final rate to be set on Apr. 18.
This issuance represents the company’s largest bond offering to date.
Proceeds from the bonds will be used to redeem existing bonds and partially fund SoftBank’s acquisition of shares in chip designer Arm from its Vision Fund, completed in August 2023.
🔗 Source: Reuters
Recent SoftBank developments
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01-Apr-2025 💼 SoftBank eyes $16.5b loan for US AI projects
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29-Mar-2025 🤖 SoftBank reportedly plans $1t AI parks in the US
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20-Mar-2025 💰 SoftBank acquires AI data center chipmaker Ampere for $6.5b
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19-Mar-2025 🔒 SoftBank scores big as Google buys Wiz for $32b
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| 14-Mar-2025 🏭 SoftBank to build $677m AI data center in former Sharp factory |
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