The United States Commerce Department has finalized a grant of up to US$458 million for SK Hynix to support the construction of a chip packaging plant and research center in Indiana.

This facility aims to produce chips for AI applications and is part of a larger US$3.87 billion investment announced by SK Hynix in April.

Additionally, the US government plans to provide US$500 million in loans, with grant disbursements tied to the company’s progress on project milestones.

This grant is part of a US$39 billion program established by Congress in August 2022 aimed at boosting US semiconductor manufacturing.

Recent SK Hynix developments