Taiwan Semiconductor Manufacturing Co. (TSMC) announced on Feb. 17 that its investment projects in Arizona are proceeding as planned.

This statement addressed a local media report regarding the timeline for its third wafer fabrication plant in the United States.

The report connected the proposed timeline to pressure from the US government under the “Made in America” initiative.

However, TSMC did not confirm any schedule changes.

The company confirmed a total investment of over US$65 billion in Arizona to construct three advanced wafer fabs.

The first facility is already producing chips using the 4-nanometer process.

Meanwhile, the second fab is set for mass production in 2028, and the third fab is expected by the end of the decade.

Recent Taiwan Semiconductor Manufacturing Co. developments