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TSMC holds first US board meeting, no new investments
Taiwan Semiconductor Manufacturing (TSMC) held its first board meeting in the United States on Feb. 12 in Arizona.
No new US investments were announced, despite market speculation.
The company is already investing US$65 billion in three wafer fabrication plants in the state.
The first facility is producing 4 nm chips, while the second will start 3 nm and 2 nm production by 2028. The third will use the A16 process, a next-generation 2 nm technology.
The board approved US$17.14 billion for technology upgrades, packaging capacity, and facility improvements.
It also allocated up to US$10 billion to TSMC Global Ltd. for foreign exchange hedging.
Recent TSMC developments
| Timeline |
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11-Feb-2025 📉 TSMC lowers Q1 outlook due to January earthquake losses
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10-Feb-2025 📊 TSMC growth slows as DeepSeek fuels AI competition
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03-Feb-2025 📉 TSMC shares under scrutiny after DeepSeek jolt
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23-Jan-2025 📈 TSMC drives Taiwan stock exchange with 30% annual gain
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