Xiaomi, a Beijing-based consumer electronics and smartphone maker, unveiled the Xring O3 smartphone processor in Beijing on Aug. 24 as it seeks greater control over key components and rely less on external chip suppliers.

TSMC will manufacture the chip using its 3-nanometre process, two people familiar with the matter said.

One source said the chip is expected to power Xiaomi’s upcoming flagship folding phone, with a shipment target of 200,000 to 300,000 units.

The O3 comes a year after Xiaomi launched the Xring O1.

Xiaomi said last week that cumulative shipments of devices using the O1 across smartphones, tablets, and watches had surpassed 1 million units.

The sources added that smartphones using the O1 have sold about 150,000 units since the chip’s May 2025 launch.

The launch does not mean Xiaomi will stop using outside suppliers.

The company aims to reduce its dependence on suppliers such as Qualcomm and MediaTek amid intensifying competition in premium smartphones, according to people familiar with the matter.

🔗 Source: Reuters

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