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TSMC capacity limits open doors for rival chip foundries

Broadcom said TSMC’s manufacturing capacity looks maxed out, raising the prospect that rival foundries could benefit, Reuters reported.

A Broadcom executive said TSMC “appears to have reached the limits of its production capacity” compared with a few years ago.

Much of the recent demand for custom AI chips has flowed to TSMC because it leads in manufacturing below 3 nanometers.

Reuters cited analysis and an industry source saying Samsung Electronics could win more foundry business as its yields at sub-3nm nodes have stabilized.

🔗 Source: Chosun Daily

🧠 Food for thought

Implications, context, and why it matters.

Samsung’s upside is limited by a wide capability gap

  • TSMC’s tight capacity creates an opening for rivals like Samsung, yet TSMC still sets the pace 1.
  • In 2025, TSMC held 69.9% of the global foundry market, while Samsung reached 7.2% 1.
  • The split tracks a gap in results and process maturity at advanced nodes (the most cutting-edge manufacturing processes). Reports put TSMC’s 3-nanometer yield near 90%, while Samsung’s sits around 50% 2.
  • That reliability gap keeps customers anchored. Nearly 99% of wafer fabrication for the top AI chip players’ AI server compute and application-specific integrated circuit (ASIC) shipments still runs through TSMC, which keeps switching costs high 3.

Capacity crunch pushes big tech toward longer contracts

  • Chip designers now treat access to production as a long-term planning problem, not a quarterly purchase.
  • To lock in supply, more firms are signing multi-year foundry deals instead of the shorter agreements that used to dominate 4.
  • Limited slots also speed up custom silicon plans. OpenAI is working with Broadcom and AMD on AI chip efforts aimed at hardware tuned for specific AI workloads 5.
  • Manufacturing still concentrates at TSMC, even for custom designs. That dependence keeps industry risk centralized and the capacity squeeze remains 5.

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