Taiwan Semiconductor Manufacturing Co. (TSMC) will build three more advanced packaging facilities in Phase II of the Chiayi Science Park, National Science and Technology Council head Wu Cheng-wen said at a July 12 groundbreaking ceremony.

The expansion comes as rising demand for high-performance computing (HPC) chips drives the need for advanced packaging capacity.

Wu said the roughly 90-hectare Phase II site will become an advanced packaging cluster led by TSMC.

Two advanced packaging facilities in Phase I began mass production in June.

Once both phases are fully operational, companies in the science park are expected to generate more than NT$300 billion (US$9.33 billion) in annual output, Wu said.

He added that the site will link with science parks in Tainan, Kaohsiung, Pingtung County, central Taiwan, and Hsinchu.

Officials said the expansion is tied to processes such as CoWoS- and SoIC-class packaging for AI and HPC chips, where packaging capacity has been a supply bottleneck.

Phase II earlier received approval for an initial environmental review, which covered water use, air pollution, ecological impact, transportation, economic output, and health risks.

Construction is expected to begin in the second half of this year, with completion targeted by 2031.

🔗 Source: Focus Taiwan

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