Samsung Electro-Mechanics, rose 3.63% in early trading on June 30 after reports said it was expected to finalize and announce a trillion-won expansion investment for its Sejong plant on July 2.

The plan includes a package-substrate line for AI servers.

The expansion would add to a site that already makes chip package substrates, including ball grid array products, for mobile devices.

Samsung said its flip-chip ball grid array, or FC-BGA, substrates are currently produced in Busan and Vietnam, so the Sejong plan would expand the company’s more advanced, server-focused packaging capacity.

Package substrates are high-density circuit boards that connect and protect chips, and FC-BGA is used in server central processing units and AI accelerators.

Samsung’s June 29 regional spending announcement was part of a broader South Korea investment plan that allocated 625 trillion won (US$406 billion) to the Yeongnam, Honam, and Chungcheong regions.

The package-substrate market is forecast to grow 10% annually through 2027.

🔗 Source: The Chosun Daily