Cadence has announced new advancements in chip design automation and intellectual property for advanced semiconductor manufacturing, in collaboration with TSMC.

Cadence, a US-based electronic design automation company, said its AI-powered design flows now support TSMC’s N2 and A16 chip technologies, as well as enhanced 3D-IC packaging using TSMC’s 3DFabric platform.

The company also introduced new silicon-proven IP, including HBM4 and LPDDR6/5x memory interfaces for TSMC’s N3P process, aimed at supporting next-generation AI infrastructure.

Cadence and TSMC have also partnered on developing EDA flows for TSMC’s upcoming A14 process, with a process design kit expected later this year.

🔗 Source: Cadence