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US chipmaker firm taps Micron, SK hynix for AI memory development
Applied Materials partnered with Micron and SK hynix to develop next-generation memory chips for AI and high-performance computing.
Micron and SK hynix will be founding partners at Applied’s Epic Center, which represents a planned US$5 billion investment in equipment and process R&D.
The Micron collaboration will target DRAM, high-bandwidth memory, and NAND, linking Applied’s Epic Center with Micron’s Boise innovation hub.
The SK hynix partnership will focus on materials, process integration, and 3D advanced packaging for next-generation DRAM and HBM.
The move comes as rising AI infrastructure demand has tightened memory supply and pushed up prices.
🔗 Source: Reuters
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Applied Materials has lined up all three top memory makers for its EPIC Center R&D hub
- Samsung Electronics joined Applied’s EPIC Center as a founding partner in February 2026, adding to Micron and SK hynix 1.
- The lineup brings together the world’s three largest memory producers, who have said they were struggling to keep up with AI-driven demand as tech firms are expected to spend at least $630 billion on AI infrastructure this year 2.
- The setup answers rising chip complexity, where new transistor designs can require more than 2,000 interdependent manufacturing steps 3.
- With memory chipmakers working alongside semiconductor equipment engineers, the center targets a shorter path than the usual 10-15 years for bringing new materials and process technologies into production 3.
The AI memory boom is reshaping the semiconductor equipment business model
- High Bandwidth Memory (HBM) can demand more tools than standard DRAM, with three to four times more wafer starts per bit, which lifts sales for equipment suppliers 3.
- Applied Materials is aiming for $3 billion in HBM-related revenue in the next few years 3.
- Customers have described a “super cycle,” with forecasts arriving much earlier than before, sometimes two years ahead, to lock in equipment slots 3.
- The EPIC approach moves Applied from tool seller to long-term partner, tied to a “value-sharing” model and faster co-innovation in advanced packaging and leading-edge logic 3.
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