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US chipmaker firm taps Micron, SK hynix for AI memory development

Applied Materials partnered with Micron and SK hynix to develop next-generation memory chips for AI and high-performance computing.

Micron and SK hynix will be founding partners at Applied’s Epic Center, which represents a planned US$5 billion investment in equipment and process R&D.

The Micron collaboration will target DRAM, high-bandwidth memory, and NAND, linking Applied’s Epic Center with Micron’s Boise innovation hub.

The SK hynix partnership will focus on materials, process integration, and 3D advanced packaging for next-generation DRAM and HBM.

The move comes as rising AI infrastructure demand has tightened memory supply and pushed up prices.

🔗 Source: Reuters

🧠 Food for thought

Implications, context, and why it matters.

Applied Materials has lined up all three top memory makers for its EPIC Center R&D hub

  • Samsung Electronics joined Applied’s EPIC Center as a founding partner in February 2026, adding to Micron and SK hynix 1.
  • The lineup brings together the world’s three largest memory producers, who have said they were struggling to keep up with AI-driven demand as tech firms are expected to spend at least $630 billion on AI infrastructure this year 2.
  • The setup answers rising chip complexity, where new transistor designs can require more than 2,000 interdependent manufacturing steps 3.
  • With memory chipmakers working alongside semiconductor equipment engineers, the center targets a shorter path than the usual 10-15 years for bringing new materials and process technologies into production 3.

The AI memory boom is reshaping the semiconductor equipment business model

  • High Bandwidth Memory (HBM) can demand more tools than standard DRAM, with three to four times more wafer starts per bit, which lifts sales for equipment suppliers 3.
  • Applied Materials is aiming for $3 billion in HBM-related revenue in the next few years 3.
  • Customers have described a “super cycle,” with forecasts arriving much earlier than before, sometimes two years ahead, to lock in equipment slots 3.
  • The EPIC approach moves Applied from tool seller to long-term partner, tied to a “value-sharing” model and faster co-innovation in advanced packaging and leading-edge logic 3.

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