Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chipmaker, is considering making advanced memory chips at Nvidia’s request, according to a November 6 report.

The report said TSMC had started planning for 3D DRAM, or three-dimensional dynamic random access memory.

The company is weighing new factories or the purchase and conversion of an existing plant, with vice president Hsu Kuo-chin leading the effort. The timing of production remains unclear.

DRAM stores data temporarily in devices. In 3D DRAM, memory cells are stacked vertically rather than arranged in a single horizontal layer to increase capacity.

A move into advanced memory production would expand TSMC’s role in AI hardware. It would also put the company in competition with Samsung Electronics, SK Hynix, and Micron, a US memory chipmaker.

The report said AI-driven memory shortages had raised prices and pushed chip designers to seek more supply.

🔗 Source: Reuters

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