TSMC, Taiwan’s contract chipmaker, reduced monthly wafer starts at Fab 15A, its main 28nm production base, to 150,000 from 200,000 at the start of 2026, according to supply chain sources.

The report said the 25% drop reflects TSMC’s plan to allocate more 28nm capacity to support interposer production and gradually pull back from lower-margin orders.

Fab 15A is part of TSMC’s Central Taiwan Science Park operations and originally focused on 28nm to 22nm processes, while Fab 15B in the same complex mainly handles 7nm production.

Chips still made on 28nm-class processes include smartphone liquid-crystal display and organic light-emitting diode display-driver integrated circuits.

Omdia said these chips are mostly produced on 28nm to 90nm 12-inch wafers.

🔗 Source: Jiemian

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