Taiwan broke ground on an advanced packaging industrial park in Kaohsiung on September 21, where TSMC plans to build a technology validation laboratory and talent training center.

The facilities will support advanced packaging for AI and high-performance computing, with operations expected to begin in the fourth quarter of 2029.

Kaohsiung Deputy Mayor Lo Ta-sheng said TSMC will build and occupy two buildings at Baipu Industrial Park, while the Kaohsiung city government will build factory facilities.

President Lai Ching-te said the site will let equipment and materials suppliers conduct research, testing, and validation closer to production as Taiwan expands its southern semiconductor cluster alongside ASE Technology Holding, a Taiwan-based semiconductor assembly and testing company, and Foxconn.

🔗 Source: Reuters

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