Gallant Micro Machining Co, a supplier of advanced packaging equipment to Taiwan Semiconductor Manufacturing Co (TSMC), reported record orders totaling NT$1 billion (US$30.21 million) for 2025.

The increase is driven by strong demand for advanced chip packaging technology, particularly chip-on-wafer-on-substrate (CoWoS) technology used in AI chip production.

According to president Stone Shih, order visibility has improved and extends through the first quarter of 2026.

Shih expressed optimism about continued growth, citing the ongoing AI boom as a significant factor.

Additionally, Gallant Micro plans to establish an office and production line in the US, with the first production line expected within two years.

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