Taiwan-based chipmaker TSMC said in Hsinchu on July 13 that its consolidated revenue for June 2026 reached NT$442.68 billion (US$13.8 billion), up 6.2% from May and 67.9% from a year earlier.

For the first six months of 2026, TSMC’s revenue totalled NT$2.404 trillion (US$74.8 billion), up 35.6% from NT$1.773 trillion (US$55.2 billion) in the same period last year.

Separate industry research published in late 2025 said TSMC was targeting chip-on-wafer-on-substrate (CoWoS) advanced packaging capacity of 120,000 to 130,000 wafers per month by the end of 2026, up from about 75,000 to 80,000.

The research also said TSMC planned to outsource 240,000 to 270,000 wafers a year to outsourced semiconductor assembly and test (OSAT) partners to help ease supply bottlenecks linked to AI chip demand.

🔗 Source: TSMC

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