Tata Electronics plans to start chip packaging for global automotive and industrial clients at its new OSAT plant in Jagiroad, Assam, ahead of a wider ramp-up later this year, people familiar with the matter said.

OSAT, or outsourced semiconductor assembly and test, refers to packaging, testing, and inspection after semiconductor wafers are made.

Tata said its Assam site will support wire bond, flip chip, and integrated system packaging for segments including automotive.

The company has started small-scale shipments from its first facility in Vemgal, Karnataka, and is moving one product line and a team to the roughly 271.2 billion rupees (US$2.83 billion) Assam plant.

Tata previously said the facility’s first phase was expected to become operational by mid-2025.

The Jagiroad facility is being built under India’s semiconductor policy and Assam’s electronics policy, with capacity of up to 48 million semiconductor chips a day.

Counterpoint Research vice-president Neil Shah said phased cleanroom launches are standard because they let chip plants qualify yields, tools, and logistics before full production.

🔗 Source: The Economic Times

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