Taiwanese chipmaker United Microelectronics Corporation (UMC) has opened a new semiconductor fabrication facility in Singapore.

The first phase of the facility, located in the Pasir Ris Wafer Fab Park, is expected to begin production in 2026.

UMC has invested up to US$5 billion in the facility, which will have a capacity of 30,000 wafers per month during its first phase.

The site will focus on manufacturing semiconductors using 22nm and 28nm processes for applications in smartphones, IoT, automotive, and AI sectors.

UMC operates 12 fabrication facilities worldwide and provides semiconductor manufacturing services for various industries.