Taiwan’s chip testing and packaging services provider, Powertech Technology Inc. (PTI), expects a rebound in its business starting in Q2 2025, following a challenging Q4 2024 earnings report.

CEO Boris Hsieh highlighted that this recovery will be fueled by orders from a major US customer, along with the rising demand for DRAM chips, driven by AI integration into devices.

Powertech is expanding its chip packaging capabilities, investing NT$15 billion (US$457.8 million) in technologies like 2.5D and 3D IC packaging.

In Q4 2024, the company reported a 55.7% year-on-year decline in net profit, primarily due to a gain from the sale of a Chinese plant.