Taiwan is strengthening its semiconductor supply chain in Central Europe through partnerships with Germany, the Czech Republic, and Poland.

A key driver is Taiwan Semiconductor Manufacturing’s (TSMC) €10 billion (US$10.33 billion) investment in a new semiconductor fabrication plant in Dresden, Germany.

Construction began in August 2024, with mass production expected to start by late 2027, focusing on automotive and industrial chips.

Taiwan’s economic minister Kuo Jyh-huei visited Germany and the Czech Republic in December 2024 to boost industrial cooperation.

The Taiwan Trade and Investment Center in Prague was opened to promote collaboration in AI and information and communication technologies (ICT).

In the Czech Republic, Taiwanese companies like Wistron, Inventec, and Acer are expanding in Brno, while the government aims to integrate with Taiwan’s wafer foundries.