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SK hynix unveils new AI memory chips at CES 2026
SK hynix will display its latest AI-focused memory products at CES 2026 in Las Vegas from January 6 to 9.
SK hynix will debut its 16-layer HBM4 with 48 GB for the first time; both the 12-layer and 16-layer HBM4 are still under development.
The company will also present its 12-layer HBM3E with 36 GB and demonstrate GPU modules using this memory for AI server applications.
Other products on display include SOCAMM2, a low-power memory module for AI servers, and LPDDR6, designed for on-device AI.
SK hynix will show its 321-layer 2 Tb QLC NAND flash, targeting high-capacity enterprise SSDs used in AI data centers.
🔗 Source: SK hynix
