SK Group chairman Chey Tae-won said at Computex in Taipei on June 2 that SK hynix plans to double wafer capacity over the next five years.

The company also plans to expand partnership in Taiwan beyond TSMC, and supply high-bandwidth memory for Nvidia’s Vera Rubin system.

Industry reports tied the expansion to SK hynix’s Cheongju M15X fabrication plant, which is dedicated to HBM4 and could lift dynamic random-access memory capacity to about 620,000 wafers a month by late 2026, up from the mid-300,000s in 2023.

Taiwan is also central to advanced packaging, with SK hynix, Nvidia, and TSMC optimizing chip-on-wafer-on-substrate integration for HBM4.

Nvidia said Vera Rubin uses HBM4 and nearly triples memory bandwidth vs. Blackwell, making the system a target for memory suppliers.

Chey’s March warning of a wafer shortage until 2030 aligns with SEMI data showing global silicon wafer shipments rose 13.1% year on year in the first quarter of 2026, driven by AI demand for advanced logic and memory chips.

Counterpoint Research said SK hynix held 58% of the global HBM market in the first quarter, while Samsung and Micron each had 21%.

🔗 Source: Reuters

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