South Korean semiconductor company SK hynix has appointed vice president Lee Woong-sun to oversee its new chip packaging plant in Indiana, US.

The facility, which includes a research and development center, was announced in April 2024 with an investment of US$3.87 billion.

It has received US$458 million in direct funding and up to US$500 million in loans through the US CHIPS and Science Act.

Mass production of high bandwidth memory (HBM) chips is expected to begin in the second half of 2028.

Lee has been leading SK hynix Semiconductor West Lafayette LLC since late 2024. He brings extensive experience in advanced packaging and wafer-level packaging manufacturing.

SK hynix plans to collaborate with Purdue University and local research institutions on semiconductor research.

The company is also increasing its presence in the US HBM market, providing components for GPUs used in AI processors.

Recent SK hynix developments