Siemens, the German industrial technology company, said on September 29 that it had expanded its work with TSMC on AI-powered semiconductor design automation.

The aim is to help shared customers improve productivity, shorten design cycles, and manage rising chip design complexity.

The expanded collaboration includes an AI-powered agent for automated design rule check fixes across digital and custom integrated circuit design flows, using Siemens’ Calibre, Aprisa, and Solido software.

It also covers agentic workflows for custom integrated circuit design, place-and-route, and digital implementation.

Siemens also said its electronic design automation portfolio supports TSMC’s advanced process technologies, 3D integrated circuit and advanced packaging technologies, including TSMC 3DFabric, silicon photonics, and chip-package co-design workflows.

The move expands an existing relationship rather than creating a new one.

Siemens already participates in TSMC’s Open Innovation Platform ecosystem, which includes multiple electronic design automation vendors, and the two companies have worked together before.

It also follows a broader TSMC trend. Synopsys partnered with the chipmaker on AI-focused certified electronic design automation flows in April 2026.

🔗 Source: Siemens

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