Samsung Electronics unveiled new memory and storage technologies as it seeks to strengthen its position in AI hardware.

The company said it plans to increase high-bandwidth memory 4 (HBM4) production in the second half of 2026.

Samsung also introduced zHBM, zNAND-O, and its V10 BV-NAND architecture with more than 400 layers.

Samsung ranked third in the high-bandwidth memory (HBM) market in the second quarter of 2025, with a 17% share, behind SK hynix at 62% and Micron at 21%.

Its position improved after securing Nvidia’s qualification for 12-layer HBM3E in September 2025. Samsung was expected to begin supplying Nvidia as its third HBM vendor with limited volumes.

The semiconductor memory market is projected to reach about US$190 billion in 2026 and remain below US$450 billion by 2034.

🔗 Source: Bloomberg