Samsung signs AMD deal to supply HBM4 for AI chips

Samsung Electronics and AMD signed a deal to expand memory chip supplies for AI infrastructure covering Samsung’s HBM4, the companies said.

The agreement also opens talks on a potential foundry partnership under which Samsung could provide contract manufacturing for next-generation AMD products.

Samsung has supplied memory chips for AMD’s AI accelerators and aims to supply HBM4 next.

The announcement came during the week of Nvidia’s event, where Jensen Huang, CEO of Nvidia, announced a foundry tie-up with the Korean firm and praised its HBM4 chips.

The tie-up highlights a broader race among global chipmakers to lock in long-term advanced memory supplies as AI demand tightens HBM availability.

According to Counterpoint, Samsung holds about 22% of the global HBM market while SK Hynix holds about 57%.

🔗 Source: Reuters

🧠 Food for thought

Implications, context, and why it matters.

Samsung’s HBM comeback is recent and hard-won

Samsung held 22% of the High Bandwidth Memory (HBM) market after a recent rebound 1.
In Q2 2025, its share slid to 17% and ranked third behind SK Hynix and Micron 2.
Samsung moved back to second place in Q3 2025 after ramping supply of its High Bandwidth Memory (HBM)3E products 1.
Analysts expect Samsung’s HBM share to top 30% in 2026 if it lands next-generation HBM4 customers, including AMD 2.

The foundry talks could matter more, amid efforts to reduce reliance on TSMC

Beyond memory supply, Samsung has reportedly discussed a foundry partnership with AMD for next-generation EPYC “Venice” CPUs on Samsung’s 2nm node 3.
Samsung Foundry (Samsung’s contract chip-manufacturing business) has chased top-tier customers, while AMD has leaned on TSMC (Taiwan Semiconductor Manufacturing Company) for leading-edge production 4.
Reports link that history to worries about process maturity and yields, which have often tilted decisions toward TSMC 4.
TSMC’s lines are also said to be tightly booked, which supports interest in dual sourcing among chip designers 3.