Samsung Q3 revenue jumps 15.4% to $60.5b on memory chip demand

Samsung Electronics reported Q3 2025 revenue of 86.1 trillion won (US$60.52 billion) and operating profit of 12.2 trillion won (US$8.43 billion), with revenue up 15.4% quarter-on-quarter.

The company reported record-high quarterly sales in its memory business, driven by strong demand for HBM3E and server SSDs.

Samsung’s Device Solutions unit recorded 33.1 trillion won (US$23.26 billion) in revenue and 7 trillion won (US$4.92 billion) in operating profit, while its display unit posted 8.1 trillion won (US$5.69 billion) in revenue and 1.2 trillion won (US$843.55 million) in operating profit.

The mobile division, which includes the Galaxy Z Fold7, reported 34.1 trillion won (US$23.97 billion) in revenue and 3.6 trillion won (US$23.97 billion) in operating profit, supported by robust flagship smartphone sales.

Samsung’s TV and appliance division saw revenue of 13.9 trillion won (US$9.77 billion) and an operating loss of 100 billion won (US$70.29 billion), citing increased competition.

The company expects ongoing demand for AI-related products to drive future growth across its core business units.

🔗 Source: Samsung

🧠 Food for thought

Implications, context, and why it matters.

Record memory sales with unclear HBM and capex outlook

Q3 memory sales line up with plans to build Pyeongtaek Plant 5 for HBM4, with groundbreaking as early as October 2025 1 and first supply targeted for Q4 2025 2.
Samsung cleared HBM4 mass production and is prepping samples for customer talks, while installing the 10nm-class 6th-generation (1c) dynamic random-access memory (DRAM) process on an empty line at Pyeongtaek Plant 4 1.
Capacity rises from 130K to 160–170K wafers per month by end of 2025, with focus on quality gains over rapid expansion 2.
Revenue does not make clear if HBM3E, a current-generation HBM variant, has won customer qualifications or if pricing holds past AI server spikes. Investors remain unsure about 2026 growth.

Suppliers target Samsung’s HBM buildout timeline

Pyeongtaek Plant 4 (P4) shifts to HBM4 base while Plant 5 (P5) rises 3 1. That creates buys for extreme ultraviolet (EUV) lithography and through-silicon via (TSV) technologies 3 1. Interposers and advanced packaging materials also see demand 3 1.
The move to the 1c DRAM process for HBM4 adds EUV layers and uses High-K Metal Gate (HKMG) technology, a transistor architecture that cuts leakage 2. That drives demand for specialized deposition and etching tools 2.
Construction and engineering firms can bid on P5 work, with steel work and safety training underway 1.
Testing and inspection tool makers see openings as Samsung works on yield, the share of chips meeting specifications 2. Thermal limits from dense vertical stacking of memory dies need work 2.