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Samsung Electro-Mechanics targets AI data center demand
Samsung Electro-Mechanics said that it can supply key components for AI data centers, as it sought to win more orders in the second half.
The company said it is the only supplier able to provide core component solutions for AI data centers, a claim it did not substantiate.
The event drew overseas customers across multiple industries.
Samsung Electro-Mechanics showcased components for AI servers (MLCCs), networks, automotive chips, and power trains, along with ultra-thin power inductors.
It also held seminars on components for EVs, autonomous driving, and AI infrastructure.
🔗 Source: The Korea Herald
🧠 Food for thought
Implications, context, and why it matters.
Samsung’s claim clashes with its role as a second source
- Samsung Electro-Mechanics (SEMCO) is widely seen as the world’s No. 2 maker of multilayer ceramic capacitors (MLCCs), small parts that manage power and signals in electronic devices 1.
- A few companies control this market. Murata Manufacturing holds about 40% of global share, while SEMCO has about 20% to 25% 1.
- SEMCO matters to AI hardware builders because it gives them a viable second source for MLCCs, which lowers supply chain risk and eases dependence on Murata 1.
AI components bring rich margins and hard production limits
- AI servers use more than 10 to 15 times as many MLCCs as general-purpose servers, which helps explain the company’s push into AI 2.
- These parts sell for two to three times the price of standard IT MLCCs. AI-related MLCCs made up 3% of revenue in 2023, rose to 9% in 2024, and were expected to top 10% in 2025 1.
- Making them is hard. Even stable high-end MLCC lines may stay at 60% to 70% yield, which limits profit even with higher average selling prices (ASPs) 1.
- Pressure also runs through flip-chip ball grid array (FC-BGA) substrates, advanced chip packaging materials used to connect processors to circuit boards. Demand is more than 50% above capacity, creating a seller’s market where SEMCO has raised prices on some FC-BGA products 3.
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