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Samsung Electro-Mechanics eyes AI chip packaging expansion

Samsung Electro-Mechanics is considering expanding its advanced chip packaging production as demand for AI hardware grows, CEO Chang Duck-hyun said at CES 2026 in Las Vegas.

The South Korean company plans to run its flip-chip ball grid array (FC-BGA) production lines at full capacity in H2 2026.

Chang said the company is reviewing further capacity expansion due to increased demand from AI servers and data centers.

FC-BGA and multilayer ceramic capacitors (MLCCs) are key components in AI applications, with rising demand linked to growing chip complexity.

Samsung Electro-Mechanics is also discussing potential supply of camera modules, MLCCs, and FC-BGA to companies developing humanoid robots.

🔗 Source: Korea Times

🧠 Food for thought

Implications, context, and why it matters.

FC-BGA capacity timing hinges on unspecified scale and customer mix

  • Samsung Electro-Mechanics targets H2 2026 for full output on key lines, but context is missing. The firm invested $850 million in Vietnamese FC-BGA sites through 2023, 1.9 trillion KRW in Busan and Vietnam plants. It has not shared total capacity or product mix. It only lists goals above 110 mm area and over 26 layers 123.
  • Device mix stays unknown across mobile, PC, and server. The split between standard substrates and AI-optimized versions, the laminated base boards under high-end processors, is also unclear. Samsung Electro-Mechanics signed an AMD high-performance computing server deal in July and wants high-value FC-BGA to top 50% by 2026, but volumes remain undisclosed 2.
  • Market growth runs near 14% each year as AI servers and data centers move to 60–70% of demand from a prior PC tilt, yet Samsung Electro-Mechanics’ slice remains uncounted 13.

Substrate tooling and materials suppliers can map forthcoming capacity waves

  • This build is one datapoint for equipment makers and specialty chemical suppliers. The Vietnam plant runs AI-driven process control and supports 5 µm copper lines which signals needs for lithography (patterning), via drilling (hole formation between layers), plus metrology tools (precision measurement) 2.
  • Taiwanese substrate makers are exiting post-pandemic cuts as AI GPU, CPU, and ASIC buyers lift orders 4. Tracking global additions that span Samsung Electro-Mechanics’ ramp, rival builds in Korea, Taiwan, and moves by Japanese incumbents helps toolmakers schedule launches. Service teams can stage support before qualification.
  • Investors in semiconductor materials and equipment can use aggregated capacity data to size total addressable markets for Ajinomoto Build-up Film (ABF), copper foils, and photoresists (light-sensitive coatings used in lithography). Those consumables scale with layer counts and production volumes across many players, not one company’s build.

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