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Samsung Electro-Mechanics bets $1.2b on Vietnam AI chips

Samsung Electro-Mechanics to invest 1.8 trillion won (US$1.21 billion), in Vietnam to expand output of FC-BGA semiconductor substrates used in AI servers and other high-performance chips.

FC-BGA connects chips to substrates and helps improve data transfer and heat control, and the company has produced the product in Vietnam since 2024.

The new investment matches the US$1.2 billion Samsung Electro-Mechanics put into its Vietnam unit when it was set up in 2013.

Samsung Electro-Mechanics said demand for server and data center FC-BGA is more than 50% above current production capacity and that the company is adding investment and expanding some factories.

🔗 Source: Chosun Daily

🧠 Food for thought

Implications, context, and why it matters.

Vietnam investment is one piece of a global strategy to capitalize on a component shortage

  • Samsung Electro-Mechanics’ president said demand for FC-BGA substrates used in AI servers and data centers runs more than 50% above current production capacity 1.
  • Tight supply lets the company lift prices on some FC-BGA products. Mirae Asset Securities, a South Korean financial services firm, raised its FC-BGA price estimates by about 10% 1.
  • The new spending targets Vietnam. Samsung Electro-Mechanics is also expanding plants in Busan and Sejong, South Korea 1.
  • Kyobo Securities, a South Korean brokerage, raised its target stock price and expects operating profit to double within two years 1.

Today’s substrate profits are funding tomorrow’s next-generation chip packaging

  • While it grows FC-BGA output, Samsung Electro-Mechanics is developing glass substrates that can improve performance for larger AI chips 2.
  • Industry sources say Samsung Electro-Mechanics is supplying early glass substrate samples to potential customers including Apple and Broadcom, a US chip designer 2.
  • Mass production of glass substrates is targeted for after 2027. Strong demand for current products helps pay for the shift and could shape product plans at large tech companies 2.

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