Samsung Electronics is considering an advanced semiconductor packaging plant in Gwangju, South Korea, and could announce the plan at a June 29 meeting with President Lee Jae Myung, according to unnamed industry sources.

Samsung declined to comment, while the presidential office said companies determine investment decisions.

The proposed facility would support Samsung’s push into advanced chip packaging, a key part of the AI chip supply chain as demand for high-bandwidth memory (HBM) continues to rise.

Advanced packaging improves performance by integrating multiple chips into a single package.

Samsung said in May that it had begun shipping samples of its 12-layer HBM4E chips to customers.

The company is also seeking to expand its position in the HBM market, where it is competing more aggressively with SK hynix.

🔗 Source: Reuters

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