Oriental Semiconductor, a Shanghai-listed Chinese power semiconductor company, said on July 2 that it plans to raise up to 1.4 billion yuan (US$212 million), including issuance expenses, through convertible bonds.

After deducting issuance expenses, the proceeds will fund next-generation power management control chip R&D and industrialization, the construction of an R&D center, and working capital.

Suzhou Oriental Semiconductor Co Ltd in Suzhou, Jiangsu province, will carry out the company’s new power device technology and product R&D and industrialization project.

The project has a total investment of 548 million yuan (US$80.7 million), all of which may come from the fundraising, and a construction period of 36 months.

Oriental Semiconductor said the money will support the development and industrialization of silicon carbide and gallium nitride devices, including products already in delivery, under customer verification, or nearing mass production.

It will also support prototype development for gallium oxide devices.

The company said its 2025 R&D spending rose 21.93% year on year to 92.3 million yuan (US$13.6 million), while its number of R&D staff increased 13.04% by the end of 2025.

The plan targets markets including data center power supplies, new energy vehicles, and solid-state transformers.

🔗 Source: Security Times