Nvidia said at GTC Taipei on June 3 it had started shipping its new Spectrum-X co-packaged optics (CPO) switch to select partners.

The switch, developed with TSMC, is designed to address data-transfer bottlenecks and reduce power consumption in AI data centers.

Unlike conventional switches that use pluggable transceivers, the design replaces those modules by placing silicon photonics on the same package as the switch application-specific integrated circuit (ASIC).

Nvidia said this reduced electrical loss and could cut interface power from about 30 watts to as low as 9 watts.

The system delivered up to 400 terabits per second of aggregate bandwidth.

TSMC’s role goes beyond fabrication to include its COUPE silicon photonics packaging platform, which Nvidia said uses TSMC-SoIC 3D chip stacking to package optical engines with switch silicon.

Production capacity is expected to expand in the second half of 2025.

The rollout also puts Nvidia in an active CPO market. Broadcom said its second-generation chipset is already volume-produced.

🔗 Source: Focus Taiwan

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