Nvidia’s CEO, Jensen Huang, confirmed strong demand for advanced packaging technologies from Taiwan Semiconductor Manufacturing Co (TSMC) during a visit to Taichung, Taiwan.

He said that Nvidia is shifting its focus to the CoWoS-L technology for its latest Blackwell chips, instead of cutting manufacturing orders.

The Blackwell chips, introduced in March 2024, use TSMC’s chip-on-wafer-on-substrate (CoWoS) packaging technology.

Nvidia currently employs CoWoS-S for its previous Hopper platform chips but will gradually transition to CoWoS-L.

Earlier reports suggested Nvidia intended to reduce orders for CoWoS-S technology, which could affect TSMC’s revenue.

However, Huang clarified that advanced packaging capacity has significantly increased and is “probably four times” greater than two years ago.