Nvidia rally lifts Asian chip and robotics stocks

Bloomberg’s gauge of Asian chipmakers rose as much as 5.5% after Nvidia’s latest report.

CEO Jensen Huang said AI demand is widening beyond large cloud companies to robotics, automated vehicles, and lower-end chips.

Samsung, SK hynix, SoftBank, TSMC and Hon Hai all rose after Nvidia’s results.

LG Electronics and Hyundai Mobis climbed more than 20%, MediaTek hit its daily limit in Taiwan.

Bloomberg data showed Asian suppliers now account for about 90% of Nvidia’s production costs, up from roughly 65% last year.

🔗 Source: Bloomberg

🧠 Food for thought

Implications, context, and why it matters.

Shares in Hyundai Mobis, an auto parts supplier, and LG Electronics, a consumer electronics company, have climbed as investors back Hyundai Motor Group’s push into physical AI 1.
At CES 2026, the consumer technology trade show, Hyundai Motor Group said it aims to build an annual system that can make 30,000 robots by 2028. It also introduced the mass-production version of Boston Dynamics humanoid robot Atlas. Boston Dynamics is the robotics company Hyundai owns 2.
The plan could make Hyundai Motor Group a large buyer of robots and AI hardware. That fits the view that AI demand is spreading into robotics and automated vehicles, said Jensen Huang, CEO, Nvidia 1.

Nvidia is pushing further into robotics and automotive platforms with Jetson Thor and DRIVE AGX Thor. That adds demand for the same tight upstream supply, especially Taiwan Semiconductor Manufacturing’s leading-edge wafer capacity, that supports its wider GPU roadmap 3.
These physical AI products may not need Taiwan Semiconductor Manufacturing’s CoWoS advanced packaging, a chip-packaging technology that is a primary bottleneck for data center GPU production. They still use the company’s 3-nanometer wafers and LPDDR5X memory, a type of low-power memory, from Samsung or SK Hynix 3.
Demand could tighten further if OpenAI moves ahead with Broadcom on AI chips that are planned to use Taiwan Semiconductor Manufacturing’s 3-nanometer process and CoWoS packaging with High Bandwidth Memory (HBM). Mass production is expected to start in 2026, which would focus even more demand on a small group of Asian suppliers 4.