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MIT spinout Vertical Semiconductor secures $11m for AI power chips

Vertical Semiconductor, a US-based chipmaker spun out of MIT, has raised US$11 million in seed funding led by Playground Global.

Other investors in the round include JIMCO Technology Ventures, milemark•capital, and Shin-Etsu Chemical.

The funds will support Vertical’s work on vertical gallium nitride (GaN) transistors for power solutions in AI data centers.

Vertical says its technology aims to improve energy efficiency and reduce heat compared to conventional approaches, using a novel vertical GaN architecture.

The company has demonstrated its technology on 8-inch wafers with standard semiconductor manufacturing methods.

Vertical plans to start early sampling of its first prototype packaged devices by the end of 2025, with a fully integrated solution targeted for 2026.

🔗 Source: Vertical Semiconductor

🧠 Food for thought

Implications, context, and why it matters.

No disclosed proof of commercial readiness for 8-inch silicon CMOS-compatible vertical GaN

  • Vertical says its vertical GaN (gallium nitride) transistors lift efficiency by up to 30% and run on 8‑inch (200 mm) wafers on standard silicon CMOS lines. It has shared no JEDEC-grade reliability data. JEDEC is the semiconductor industry standards organization for device qualification. It has shared no independent third‑party validation or production‑scale yields that would confirm manufacturability at 200 mm.
  • Sampling is planned by year‑end, with a fully integrated solution in 2026. Navitas Semiconductor and Powerchip Semiconductor Manufacturing Corporation (PSMC) announced 200 mm GaN production. Foundries plus integrated device manufacturers (IDMs) are pushing GaN, leaving Vertical’s timing edge and differentiation unproven.
  • GaN parts spanning 100 V to 1.2 kV are feasible. Commercial qualification needs extensive tests such as high‑temperature operating life, humidity, and thermal cycling. Vertical has not disclosed results for these steps.

48V data center power architecture shift creates adjacent opportunities

  • Data centers are adopting 48 V distribution and ORv3 (Open Rack Version 3) racks. OCP (Open Compute Project) sets 48 V power requirements. This shift drives demand for GaN, power modules, magnetics, power delivery network (PDN) simulation tools, and thermal solutions for higher density.
  • Cloud and enterprise operators deploying AI need visibility into which hyperscalers, the largest cloud providers, are implementing 48 V and ORv3. That insight enables targeted integration, rack‑level power optimization, and advanced thermal work. Wiwynn, a major server and rack system integrator, uses a two‑stage 48 V design that helps integrators capture value beyond component sales.
  • Investors can watch GaN vendors, PDN software firms, liquid cooling makers for 48 V racks, and modular power shelf suppliers.

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