Micron, a US memory chipmaker, plans to raise monthly high-bandwidth memory (HBM) output to about 100,000 wafers by the end of 2026, from about 40,000 to 50,000 wafers in 2025, reports on September 4 said, as demand for AI chips keeps global HBM supply tight.

The reports said Micron has placed additional orders with HBM equipment suppliers, is installing equipment at production sites in Taiwan and Singapore, and will increase output of 12-layer HBM4 for Nvidia’s Vera Rubin platform.

Twelve-layer HBM4 stacks more dynamic random-access memory (DRAM) dies in one package to increase density and bandwidth for AI accelerators, and Nvidia describes Vera Rubin as its next data center AI platform.

Industry estimates put Samsung Electronics and SK Hynix each at 150,000 to 200,000 wafers a month.

Counterpoint Research estimated global HBM market share in the second quarter of 2026 at 50% for SK Hynix, 32% for Samsung Electronics, and 18% for Micron.

🔗 Source: Cailianshe

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