HyperLight, a Cambridge, Massachusetts-based photonics company, said on June 18 it closed an $80 million series C led by MediaTek to expand production for AI infrastructure.

The round included UMC Capital, Jabil, Foxconn, EDBI, CDIB-TEN Capital, Qatar Investment Authority, other strategic investors, and existing backers Summit Partners, The Engine, Foothill Ventures, and Xora Innovation.

HyperLight said it will expand manufacturing capacity, speed up customer qualification, scale its TFLN Chiplet platform. The company will also deepen partnerships across foundry, semiconductor, networking, and systems integration.

The plan builds on its manufacturing partnership with UMC and Wavetek for 6-inch and 8-inch wafers.

Thin-film lithium niobate has been positioned as a next-generation photonics material.

HyperLight said the material can address performance limits in current photonic integrated circuits used for data-center and AI links.

The raise follows HyperLight’s $37 million series B in September 2024. It also comes as Jabil has expanded silicon photonics packaging for co-packaged optics.

🔗 Source: HyperLight