LG Innotek, a South Korean electronic components maker, said on June 16 it was working with North American customers, to develop large semiconductor substrates for AI applications and expected “tangible results” by year-end.

The company said it was developing flip chip ball grid array, or FC-BGA, substrates above 100mm for AI servers, with customer inquiries already at 200mm products.

It expected mass production of server-network FC-BGA substrates to begin in the second half of this year, followed by FC-BGA substrates for AI training and inference in 2027.

FC-BGA substrates connect chips such as central processing units, graphics processing units, and high-bandwidth memory to external systems in AI servers.

100mm-class bodies are associated with top-end data-center chips.

The project extends the FC-BGA strategy LG Innotek entered in 2022.

LG Innotek also said it would begin building a semiconductor substrate plant in Vietnam this month, invest about 1 trillion won (US$660 million) in radio frequency system-in-package and flip chip chip-scale package facilities, expand FC-BGA production.

The company plans to target more than 1 trillion won (US$660 million) in annual operating profit from its substrate business by 2031.

🔗 Source: The Korea Times

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