South Korea-based AI chip startup FuriosaAI said on May 28 that it had signed a partnership with Broadcom to co-develop a next-generation AI inference platform for hyperscale AI environments using a multi-die chiplet design.

The project will build on FuriosaAI’s existing accelerator, developed with manufacturing support from TSCM and SK hynix.

The companies also plan to develop a more advanced AI accelerator for future deployments.

Founded in 2017, FuriosaAI had raised $246 million by July 2025 and was seeking US$300 million to US$500 million to support mass production, global expansion, and development of its third-generation chip.

FuriosaAI said it had completed RNGD validation in customer environments, including Samsung SDS and LG AI Research.

The companies aimed to begin sampling the next-generation accelerator in the first half of 2028.

🔗 Source: Chosun Daily

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