On Wednesday, the United States Department of Commerce announced US$1.4 billion in funding to enhance the domestic semiconductor advanced packaging industry.

This funding is part of the CHIPS National Advanced Packaging Manufacturing Program (NAPMP) aimed at improving US manufacturing and packaging capabilities for advanced semiconductors.

Funding recipients include Absolics Inc., Applied Materials Inc., Arizona State University, and Natcast.

They will undertake projects focused on advancing packaging technologies for next-generation semiconductors.

US Secretary of Commerce Gina Raimondo said that these investments aim to bridge the gap between semiconductor technological development and large-scale commercialization.