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Intel withdraws from wafer deal with Israel’s Tower Semiconductor
Intel has announced its intention to withdraw from a 2023 agreement with Tower Semiconductor to manufacture 300-mm wafers at Intel’s New Mexico facility, according to Tower’s latest earnings report.
The deal, signed in September 2023, followed Intel’s failed US$5.4 billion acquisition attempt of Tower and involved Tower investing US$300 million in equipment at the site.
Production initially planned for New Mexico is now being redirected to Tower’s Fab7 plant in Japan. Tower said the companies are engaged in mediation to resolve the dispute.
The partnership was seen as a strategic move to strengthen ties after the merger collapse, which was blocked by regulators in China.
Despite the withdrawal, Tower reported a 14% rise in Q4 2025 revenue to US$440 million. Its market value has surpassed US$15 billion, with shares rising over 170% in the past year.
🔗 Source: Calcalist
🧠 Food for thought
Implications, context, and why it matters.
The soured deal used an older Intel factory in a practical way
- The partnership came less than a month after Intel’s failed attempt to acquire Tower, and it did not focus on leading-edge process technology 1.
- It aimed to put Intel’s underused Fab 11X in New Mexico back to work; an Intel executive called it an “older factory for older technologies” 1.
- Tower said it would invest up to $300 million in its own equipment to make mature 65-nanometer analog chips (chips used to handle real-world signals like power and radio) for power management and radio frequency applications 1.
- Together, the details frame the plan as a way to fill legacy manufacturing capacity rather than build a shared path toward future technology 1.
Intel’s exit connects with Tower’s silicon photonics growth for AI data center optics
- Tower’s 2025 growth leaned in part on silicon photonics (SiPho), a way to move data using light on silicon chips, used in data-center optical transceivers 2.
- SiPho revenue more than doubled to $228 million in 2025 2.
- That demand supports a $920 million expansion of SiPho and SiGe capacity; SiGe (silicon-germanium) is a semiconductor material commonly used for high-frequency chips, including some data-center connectivity components 2. Over 70% of SiPho capacity is reserved or in the process of being reserved through 2028, backed by customer prepayments 2.
- Tower’s updated 2028 target financial model excludes Intel Fab 11X, which implies the Intel agreement dispute does not need to be resolved to reach that model 2.
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