Intel is reportedly reviewing a hybrid power-delivery design for its 14A2 chipmaking process that would route power from both the front and back of a chip.

The change would make 14A2 a successor to Intel’s 14A node, which is set to enter risk production in 2028 and volume production in 2029.

The hybrid approach is under consideration as tighter interconnect scaling raises resistance and voltage-drop risk. A backside-only network may also struggle to supply enough current.

The design could preserve power margins, but it would also add routing and manufacturing complexity that may make yields harder to sustain.

The move would not necessarily put Intel ahead of TSMC on timing, as A16 is set for volume production in 2027.

Intel has also said it has two prospective customers for 14A, but no committed external customers yet.

🔗 Source: Chosun Daily

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