Kaynes Semicon, a subsidiary of Kaynes Technologies, is set to deliver India’s first packaged semiconductor chip by July 2025.

CEO Raghu Panicker confirmed the pilot project is nearing completion, with machinery and clean room facilities expected to be operational by May.

After qualification testing in June, Kaynes plans to ship the first batch of chips to US-based Alpha Omega Semiconductor under a multi-year agreement that will utilize 60% of the facility’s capacity in its first phase.

In February 2024, Kaynes acquired land in Sanand, Gujarat, for its outsourced semiconductor assembly and test (OSAT) unit, backed by a 3,300 crore rupees (US$386,000) investment.

The 47-acre facility, part of India Semiconductor Mission (ISM), will produce 6 million chips daily for sectors like automotive, consumer electronics, telecom, and mobile phones.