South Korea-based Hanmi Semiconductor said on October 6 it won a 24.5 billion won (US$18.1 million) order from Samsung Electro-Mechanics to supply equipment used to make AI semiconductor substrates. The contract runs from September 2 to December 17, 2027.

The order covers large-area micro Saw & Vision Placement (MSVP) systems for AI semiconductor substrate manufacturing. MSVP combines precision cutting with inspection, selection, and loading of cut products after cleaning and drying.

The contract is equivalent to 4.24% of Hanmi Semiconductor’s 2025 consolidated sales of 576.7 billion won (US$427 million), not projected sales.

Samsung Electro-Mechanics makes package substrates, including flip chip-ball grid array (FC-BGA), a type used in high-performance chips, and has linked FC-BGA to AI computing.

The order comes as Samsung Electro-Mechanics plans to invest 6.8 trillion won (US$5.02 billion) in AI-related components and substrates.

🔗 Source: Chosun Daily