Singapore-based DayOne Data Centers has secured a HK$1.86 billion (US$237 million) loan, or about US$237 million, to refinance and expand a Hong Kong data center, people familiar with the matter said.

DBS, Oversea-Chinese Banking Corporation, United Overseas Bank, and Bank of East Asia provided the facility, the people said.

DayOne is also planning a US initial public offering but is considering a delay or a smaller deal.

The company has also held early talks with banks about a potential US$500 million bond sale.

Baxtel lists DayOne’s HK1 data center in Hong Kong, but the available material does not specify its capacity or whether it is operating.

A separate industry directory lists 22 DayOne data centers.

The financing follows DayOne’s June 5, 2026 announcement that it closed a US$4.5 billion series C round, as AI-driven data center fundraising continues despite investor concerns about returns.

🔗 Source: Bloomberg

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