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Chinese chip firm Accelink ramps up AI modulator investment
China’s Accelink Technologies has increased its investment in thin-film lithium niobate modulators amid rising demand for AI computing power.
The company later set up a photonic integration division, invested around 653 million yuan (US$95.5 million) in R&D from 2020 to 2025. The company said its coherent and non-coherent modulator products began small-scale shipments in 2024 and partial mass production in 2025.
Accelink total revenue rose 47.56% year-on-year to 1.5 billion yuan (US$216 million) driven by its growing optical components business.
🔗 Source: Pandaily
🧠 Food for thought
Implications, context, and why it matters.
Growth forecasts and technical claims shaping the case for Accelink’s investment
- Forecasts for thin-film lithium niobate (TFLN) modulators diverge, with 2024 estimates at US$165.37 million 1, US$543 million 2, or US$1.12 billion 3. One source also gives a 2025–2033 compound annual growth rate (CAGR) of 42.43% for thin-film lithium niobate devices 1.
- Analysts tie part of the demand to TFLN’s lower energy use in high-speed optical links for data centers and telecom networks 4.
- One report puts TFLN modulators as low as 12 femtojoules per bit, then compares that with higher energy-per-bit figures for silicon Mach–Zehnder modulators, a type of optical device used to encode data onto light signals 1.
- Another ranking lists Accelink among the top five companies in the lithium niobate modulator chip market, with the top group holding about 60%–70% of global share 5.
What Accelink’s move suggests about supply chains and hybrid photonic integration
- Accelink’s step fits a wider push by Chinese optical-module and optical-component makers into upstream chips. One industry analysis says chip independence has been a strategic focus for optical-module manufacturers in China 6.
- A separate market-research release says wafer supply remains tight, with over half of current TFLN templates, the base material used to make these devices, coming from Guangdong, China 1.
- Alongside AI-driven data-center interconnect demand, commentary also links higher TFLN output to quantum computing roadmaps cited by Xanadu, a quantum-computing company, plus prototype radio-frequency (RF) front-end components, the parts that send and receive wireless signals, attributed to Qualcomm 1.
- Accelink’s photonic integration division tracks an industry shift toward combining TFLN devices with silicon photonics, which uses chipmaking techniques to process light, plus hybrid integration approaches in place of discrete optical components 4.




